ATSP Innovations has developed a new family of high temperature/high performance polymers called Aromatic Thermosetting coPolyesters. These resins are tailored for use in tribological, adhesive, as well as structural and electronic applications.

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The ATSP family of resins is built on crosslinkable aromatic polyester oligomers. These pre-polymers allow simplified processability in a high temperature thermoset and have extremely long shelf lifes with no need for refrigeration. The fully set materials have these features in common:

  • Thermal stability – ATSP resins are stable in air to at least 350℃ and 425℃ in nitrogen.
  • Low outgassing
  • Access to ATSP’s Self-Bond adhesive process via bond exchange reactions intrinsic to the resin termed interchain transesterication reactions