ATSP offers high temperature polymer resins featuring Tg’s up to 310℃ with moisture pickup of <0.3 wt% and outgassing lower than PEEK and polyimides through 300 ℃ as well as ablative characteristics and compatibility with ATSP’s Self-Bond process.
To address the needs of aerospace, we offer
- Estherm™ for high temperature composite applications. Estherm™ offers the performance of a thermoset polyimide with the processing flexibility of a thermoplastic.
- Self-Bond™ for your rapid assembly and high temperature adhesive needs. Self-Bond™ adhesives feature bonding times on the scale of minutes and the highest thermal performance available among polymeric adhesives.
- NOWE™ for your lightweight bearing material and corrosion resistant coating needs