ATSP Innovations was founded in 2010 at the University of Illinois at Urbana-Champaign (UIUC) Research Park. In 2020, ATSP moved its operations to the Houston area. The company is engaged in developing, producing, and commercializing a new family of resins (Aromatic Thermosetting coPolyesters, ATSP). The development of the ATSP family of resins heralds a major advance for the field of polymers – combining the advantages of a high-temperature thermoset with the processing of a thermoplastic. ATSP polymers offer ultra-high thermal stability, outstanding wear resistance, and revolutionary solid-state state bonding.
ATSP has developed unique polymer concepts with impact from structural composites ranging from launch vehicles to commercial automobiles, as well as low dielectric constant circuit boards for microelectronics, rigid structural foams, ablative material for reentry vehicles, and fast-bonding high temperature adhesives. ATSP’s team has combined decades of experience designing and developing polymers to tackle challenging industrial problems.