ATSP Innovations was founded in 2010 and has laboratory and offices located in the University of Illinois at Urbana-Champaign (UIUC) Research Park. The company is engaged in developing, producing, and commercializing a new family of resins (Aromatic Thermosetting coPolyesters, ATSP). Development of the ATSP family of resins heralds a major advance for the field of polymers – combining the advantages of a high temperature thermoset with the processing of a thermoplastic. ATSP polymers offer ultra-high thermal stability, outstanding wear resistance, and revolutionary solid-state state bonding.
ATSP has developed unique polymer concepts with impact from structural composites ranging from launch vehicles to commercial automobiles, as well as low dielectric constant circuit boards for microelectronics, rigid structural foams, ablative material for reentry vehicles, and fast-bonding high temperature adhesives. ATSP’s team has combined decades of experience designing and developing polymers to tackle challenging industrial problems.