ATSP Innovations relocates to Houston

Jacob Meyer

ATSP Innovations, Inc. was founded in 2010 by Dr. James Economy, Dr. Andreas Polycarpou and Dr. Gaetan Bonhomme and first set up operation at the University of Illinois Urbana-Champaign (UIUC) Research Park. The company is engaged in developing, producing, and commercializing a new family of resins (Aromatic Thermosetting coPolyesters, ATSP). Development of the ATSP family of resins heralds a major advance for the field of polymers – combining the advantages of a high temperature thermoset with the processing of a thermoplastic. ATSP polymers offer ultra-high thermal stability, outstanding wear resistance, and revolutionary solid-state bonding. 


In its time at the EnterpriseWorks incubator at the UIUC Research Park, ATSP has received grants and funding from several agencies including NASA, DOE, DARPA, and the Army to further develop ATSP material for a wider range of applications.  Recently, in addition to our two NASA Phase II projects, we were selected for two NASA Phase I Awards: Ultra-High Temperature Elastomer Sealing Materials and Creep-Resistant Aromatic Polyester Thermosets for Thin-Ply Composites. Working on these kinds of projects has allowed ATSP to push the limits of what polymers can do and further commercialize the products.  With the help of the funding and grants we have received, the company is now able to expand from the small laboratory space at UIUC to a larger laboratory, production, and office space in Houston, Texas. ATSP has, as well, been working on several commercial projects focusing on adhesive and bearing applications, and the move to Texas is also bringing us closer to our industry partners. Although it was a difficult choice to leave our roots at the University of Illinois, the company is excited to start this new chapter of our journey in Houston, Texas.